Advanced Packaging and R&D: Vacuum Soldering Furnace c.VACUNITE 12 c.VACUNITE 6

Vacuum Soldering Systems for Advanced Packaging and R&D

centrotherm c.VACUNITE 12 and c.VACUNITE 6 vacuum soldering systems have been designed for Advanced Packaging and Power Semiconductor applications and achieve very high heating and cooling rates. The systems meet the highest demands of start-ups and R&D departments which use vacuum to achieve voidless soldering joints.

With c.VACUNITE 12 and c.VACUNITE 6, the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.

This system is ideally suited for production facilities and start-ups which run fluxless and voidless soldering processes with various gas atmospheres (N₂, H₂ 100, N₂/H₂ 95/5). centrotherm c.VLO 6 and c.VLO 12 optionally provide wet chemical activation with HCOOH or dry chemical activation with in-situ MW plasma for ultra clean soldering joints. Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface allows to transfer data to PCs for offline programming and remote service monitoring.